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집 > 상품 > 금으로 덮인 은 철 >
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

원래 장소:

중국

브랜드 이름:

WINNER

인증:

ISO9100

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조회를 요청하다
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
제품 상세정보
코팅:
금
본드 강도:
높은
자격증:
ISO 9001
부식 저항:
높은
연장:
3~20%
제품 유형:
본딩 와이어
표면 마감:
매끄러움, 무광택, 질감
지름:
0.7-1.0mil
재료:
금,은
청정:
99.99%
강조하다:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

지불과 운송 용어
최소 주문 수량
1000m
가격
999
포장 세부 사항
롤, 중성 포장 또는 OEM 로고와 함께
배달 시간
5-8 일
지불 조건
T/T, D/A, Western Union
공급 능력
9999999
관련 제품
좋은 가격 Ultra Thin 0.05mm Gold Coated Silver Spooled Wire For High Reliability Electrical Interconnects 온라인으로 화면

Ultra Thin 0.05mm Gold Coated Silver Spooled Wire For High Reliability Electrical Interconnects

최고의 가격을 얻으십시오
좋은 가격 0.05mm Diameter Gold Plated Silver Wire for Scientific Research and Laboratory Use 온라인으로 화면

0.05mm Diameter Gold Plated Silver Wire for Scientific Research and Laboratory Use

최고의 가격을 얻으십시오
좋은 가격 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 온라인으로 화면

0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components

최고의 가격을 얻으십시오
좋은 가격 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 온라인으로 화면

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

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지금 접촉하세요
제품 설명
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5
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