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Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Beryllium Copper bonding wire

Ultrasonic bonding copper wire

0.01-0.4MM beryllium wire

Place of Origin:

CHINA

브랜드 이름:

WINNER

인증:

ISO9001

Model Number:

BC010

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Application:
Wire bonding
Bond Strength:
High
Bonding Method:
Ultrasonic, Thermocompression, Laser
Surface Finish:
Smooth
Production Method:
Drawing
Package:
Spool, Reel, Coil
Purity:
99.99%
Length:
100 meters
Melting Point:
1064 degrees Celsius
Length Meters:
500/1000
Wire Diameter:
0.01-0.4MM
강조하다:

Beryllium Copper bonding wire

,

Ultrasonic bonding copper wire

,

0.01-0.4MM beryllium wire

지불과 운송 용어
Minimum Order Quantity
1pc
가격
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8working day
Payment Terms
D/A,T/T,Western Union
Supply Ability
1000000 rolls per month
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Product Description

Our Beryllium Copper (BeCu) Wire offers the perfect combination of strength, durability, and conductivity, making it the ideal choice for upgrading and enhancing modern electronic devices. With its exceptional mechanical performance, thermal conductivity, and electrical stability, BeCu wire is widely used in demanding industries such as semiconductors, telecommunications, aerospace, and precision electronics.

Unlike conventional copper wire, Beryllium Copper Wire provides superior tensile strength, excellent fatigue resistance, and long service life, ensuring reliability even in harsh or high-load environments. Whether for connectors, relays, springs, sensors, or microelectronic components, our BeCu wire delivers stable performance and durability that you can trust.

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding 0


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